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Proceedings of the National Academy of Sciences of Belarus. Physics and Mathematics Series

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Silicon wafer bonding by the glass-like sol-gel formed nanocomposite

https://doi.org/10.29235/1561-2430-2023-59-3-233-240

Abstract

   We have herein developed a glass-forming composition and the related sol-gel technology for bonding monocrystalline silicon wafers to produce «silicon–insulator–silicon» structures. A possibility to fabricate defect-free glass-like bonding layers at the annealing temperature decreased to 1000–1100 °C is demonstrated. The composites obtained by the sol-gel method can be used in technological processes of formation of the solid compound of silicon wafers.

About the Authors

V. E. Gaishun
Francisk Skorina Gomel State University
Belarus

Vladimir E. Gaishun, Ph. D. (Physics and Mathematics), Head of the Department

Department of Optics

246028

104, Sovetskaya Str.

Gomel



Ya. A. Kosenok
Francisk Skorina Gomel State University
Belarus

Yanina A. Kosenok, h. D. (Engineering), Associate Professor, Associate Professor of the Department

Department of Optics

246028

104, Sovetskaya Str.

Gomel



V. V. Vaskevich
Francisk Skorina Gomel State University
Belarus

Vasily V. Vaskevich, Senior Lecturer

Department of Radiophysics and Electronics

246028

104, Sovetskaya Str.

Gomel



O. I. Tyulenkova
Francisk Skorina Gomel State University
Belarus

Olga I. Tyulenkova, Senior Researcher

Advanced Materials Research Laboratory

246028

104, Sovetskaya Str.

Gomel



V. E. Borisenko
Belarusian State University of Informatics and Radioelectronics
Belarus

Victor E. Borisenko, Dr. Sc. (Physics and Mathematics), Professor

220013

6, P. Brovka Str.

Minsk



N. S. Kovalchuk
JSC “INTEGRAL” – manager holding company “INTEGRAL”
Belarus

Natalia S. Kovalchuk, Ph. D. (Engineering), Assistant professor, Deputy General Director – Chief Engineer

220108

121A, Kazintsa Str.

Minsk



A. N. Pyatlitski
JSC “INTEGRAL” – manager holding company “INTEGRAL”
Belarus

Alexandr N. Pyatlitski, Ph. D. (Physics and Mathematics), Director

State Center “Belmicroanalysis”

220108

121A, Kazintsa Str.

Minsk



S. V. Chumak
JSC “INTEGRAL” – manager holding company “INTEGRAL”
Belarus

Svetlana V. Chumak, Lead Engineer

UGT

220108

121A, Kazintsa Str.

Minsk



References

1. Faudzi A. A. M., Sabzehmeidani Y., Suzumori K. Application of Micro-Electro-Mechanical Systems (MEMS) as Sensors: A Review. Journal of Robotics and Mechatronics, 2020, vol. 32, no. 2, pp. 281–288. doi: 10.20965/jrm.2020.p0281

2. Timoshenkov S. P., Bojko A. N., Simonov B. M. Methods for assembling and mounting prototype samples of microelectromechanical systems. Izvestiya vysshikh uchebnykh zavedenii. Elektronika = Proceedings of Universities. Electronics, 2010, vol. 84, no. 4, pp. 58–63 (in Russian).

3. Mihajlov P. G., Fadeev E. D., Mihajlov A. P., Sokolov A. V., Sazonova V. P. Permanent connections in designs of microelectronic sensors. Features of materials and forming technologies. Vestnik Penzenskogo gosudarstvennogo universiteta [Bulletin of the Penza State University], 2016, vol. 16, no. 4. pp. 78–85 (in Russian).

4. Kosenok Y. A., Gajshun V. E., Tyulenkova O. I. Investigation of the near-surface damaged layer in single-crystal silicon wafers after CMT. Problemy fiziki, matematiki i tekhniki = Problems of Physics, Mathematics and Technics, 2018, vol. 37, no. 4. pp. 25–29 (in Russian).

5. Suni T. Direct Wafer Bonding for MEMS and Microelectronics. Helsinki, Espoo, 2006. 89 p.

6. Ojovan M. I., Lee W. E. Immobilisation of Radioactive Waste in Glass. An Introduction to Nuclear Waste Immobilisation. Elsevier, 2014. 362 р. doi: 10.1016/b978-0-08-099392-8.00017-6


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ISSN 1561-2430 (Print)
ISSN 2524-2415 (Online)