Silicon wafer bonding by the glass-like sol-gel formed nanocomposite
https://doi.org/10.29235/1561-2430-2023-59-3-233-240
Abstract
We have herein developed a glass-forming composition and the related sol-gel technology for bonding monocrystalline silicon wafers to produce «silicon–insulator–silicon» structures. A possibility to fabricate defect-free glass-like bonding layers at the annealing temperature decreased to 1000–1100 °C is demonstrated. The composites obtained by the sol-gel method can be used in technological processes of formation of the solid compound of silicon wafers.
About the Authors
V. E. GaishunBelarus
Vladimir E. Gaishun, Ph. D. (Physics and Mathematics), Head of the Department
Department of Optics
246028
104, Sovetskaya Str.
Gomel
Ya. A. Kosenok
Belarus
Yanina A. Kosenok, h. D. (Engineering), Associate Professor, Associate Professor of the Department
Department of Optics
246028
104, Sovetskaya Str.
Gomel
V. V. Vaskevich
Belarus
Vasily V. Vaskevich, Senior Lecturer
Department of Radiophysics and Electronics
246028
104, Sovetskaya Str.
Gomel
O. I. Tyulenkova
Belarus
Olga I. Tyulenkova, Senior Researcher
Advanced Materials Research Laboratory
246028
104, Sovetskaya Str.
Gomel
V. E. Borisenko
Belarus
Victor E. Borisenko, Dr. Sc. (Physics and Mathematics), Professor
220013
6, P. Brovka Str.
Minsk
N. S. Kovalchuk
Belarus
Natalia S. Kovalchuk, Ph. D. (Engineering), Assistant professor, Deputy General Director – Chief Engineer
220108
121A, Kazintsa Str.
Minsk
A. N. Pyatlitski
Belarus
Alexandr N. Pyatlitski, Ph. D. (Physics and Mathematics), Director
State Center “Belmicroanalysis”
220108
121A, Kazintsa Str.
Minsk
S. V. Chumak
Belarus
Svetlana V. Chumak, Lead Engineer
UGT
220108
121A, Kazintsa Str.
Minsk
References
1. Faudzi A. A. M., Sabzehmeidani Y., Suzumori K. Application of Micro-Electro-Mechanical Systems (MEMS) as Sensors: A Review. Journal of Robotics and Mechatronics, 2020, vol. 32, no. 2, pp. 281–288. doi: 10.20965/jrm.2020.p0281
2. Timoshenkov S. P., Bojko A. N., Simonov B. M. Methods for assembling and mounting prototype samples of microelectromechanical systems. Izvestiya vysshikh uchebnykh zavedenii. Elektronika = Proceedings of Universities. Electronics, 2010, vol. 84, no. 4, pp. 58–63 (in Russian).
3. Mihajlov P. G., Fadeev E. D., Mihajlov A. P., Sokolov A. V., Sazonova V. P. Permanent connections in designs of microelectronic sensors. Features of materials and forming technologies. Vestnik Penzenskogo gosudarstvennogo universiteta [Bulletin of the Penza State University], 2016, vol. 16, no. 4. pp. 78–85 (in Russian).
4. Kosenok Y. A., Gajshun V. E., Tyulenkova O. I. Investigation of the near-surface damaged layer in single-crystal silicon wafers after CMT. Problemy fiziki, matematiki i tekhniki = Problems of Physics, Mathematics and Technics, 2018, vol. 37, no. 4. pp. 25–29 (in Russian).
5. Suni T. Direct Wafer Bonding for MEMS and Microelectronics. Helsinki, Espoo, 2006. 89 p.
6. Ojovan M. I., Lee W. E. Immobilisation of Radioactive Waste in Glass. An Introduction to Nuclear Waste Immobilisation. Elsevier, 2014. 362 р. doi: 10.1016/b978-0-08-099392-8.00017-6